LOCTITE® ABLESTIK 8700K
功能與優點
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
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技術資訊
| RT 模剪切強度, 2 x 2 mm on Gold | 5000.0 kg-f |
| 固化類型 | 熱固化 |
| 導熱性 | 0.5 W/mK |
| 建議固化方式, @ 175.0 °C | 1.0 小時 |
| 應用 | 晶片焊接 |
| 熱膨脹係數 (CTE) | 20.0 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 55.0 ppm/°C |
| 玻璃化溫度(Tg) | 165.0 °C |
| 顏色 | 白色 |
| 體積電阻率 | 3x10¹⁴ Ohm cm |
| 黏度, @ 25.0 °C | 45000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 8700K
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.