LOCTITE® ABLESTIK 8700K
Značajke i prednosti
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
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Dokumenti i preuzimanja
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Tehnički podaci
| Boja | Bijela |
| Koeficijent toplinske ekspanzije (CTE) | 20.0 ppm/°C |
| Koeficijent toplinske ekspanzije (CTE), Above Tg | 55.0 ppm/°C |
| Otpornost volumena | 3x10¹⁴ Ohm cm |
| Primjene | Ukalupljeno |
| Snaga smicanja u kalupu RT, 2 x 2 mm on Gold | 5000.0 kg-f |
| Temperatura prelaska u staklo (Tg) | 165.0 °C |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
| Toplinska vodljivost | 0.5 W/mK |
| Viskoznost, @ 25.0 °C | 45000.0 mPa.s (cP) |
| Zakaži stvrdnjavanje, @ 175.0 °C | 1.0 h |
LOCTITE® ABLESTIK 8700K
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.