LOCTITE® ABLESTIK QMI536
Lastnosti in prednosti
LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive
LOCTITE® ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. This material is hydrophobic and stable at high temperatures. These features produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, and Au. The adhesive also has excellent dielectric properties. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap cure oven, or utilize Skip Cure processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process. Please refer to the TDS for alternate cure times.
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Tehnične informacije
Barva | Bela |
Fizična oblika | Pasta |
Glavne značilnosti | Alfa emisije: Izjemno nizke alfa emisije, Breme: Nizko breme, Dielektričen, Hitrost strjevanja: Zelo hitro, Kompatibilen za postopek brez svinca, Modul: Nizek modul, Nanos: Preprost nanos, Oprijem: Dober oprijem |
Gostota, Maximum Final | 1.3 g/cm³ |
Izvlečna ionska vsebina, Fluorid (F-) | 20.0 ppm |
Izvlečna ionska vsebina, Kalij (K+) | 20.0 ppm |
Izvlečna ionska vsebina, Klorid (CI-) | 20.0 ppm |
Izvlečna ionska vsebina, Natrij (Na+) | 20.0 ppm |
Koeficient toplotnega raztezanja (CTE) | 98.0 ppm/°C |
Koeficient toplotnega raztezanja (CTE), Above Tg | 174.0 ppm/°C |
Modul, DMA @ 25.0 °C | 0.3 GPa (300.0 N/mm² , 43500.0 psi ) |
Način nanašanja | Dozirni sistem |
Način strjevanja | Strjevanje na podlagi toplote |
Primeri uporabe | Pritrjevalniki |
Priporočeno za uporabo s/z | Laminat, Poliimid |
Strižna trdnost RT, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe | 17.0 kg-f |
Temperatura posteklenitve (Tg) | -31.0 °C |
Tiksotropni indeks | 5.7 |
Toplotna prevodnost | 0.3 W/mK |
Viskoznost | 8500.0 mPa.s (cP) |
Število komponent | 1 Del |