LOCTITE® ABLESTIK QMI536
功能与优点
LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive
LOCTITE® ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. This material is hydrophobic and stable at high temperatures. These features produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, and Au. The adhesive also has excellent dielectric properties. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap cure oven, or utilize Skip Cure processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process. Please refer to the TDS for alternate cure times.
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技术信息
RT 模剪切强度, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe | 17.0 kg-f |
主要特性 | Alpha射线排放:超低Alpha射线排放, 介电, 便于施胶性:优秀, 固化速度:非常快, 应力:应力, 无铅工艺兼容, 模量:低, 粘接力:优秀 |
可萃取出的离子含量, 氟化物 (F-) | 20.0 ppm |
可萃取出的离子含量, 氯化物 (CI-) | 20.0 ppm |
可萃取出的离子含量, 钠 (Na+) | 20.0 ppm |
可萃取出的离子含量, 钾 (K+) | 20.0 ppm |
固化方式 | 热+紫外线 |
外观形态 | 膏状 |
密度, Maximum Final | 1.3 g/cm³ |
导热性 | 0.3 W/mK |
应用 | 芯片焊接 |
应用方法 | 加药装置 |
推荐与以下物料搭配使用 | 层压材料, 聚酰亚胺 |
模量, DMA @ 25.0 °C | 0.3 GPa (300.0 N/mm² , 43500.0 psi ) |
热膨胀系数 (CTE) | 98.0 ppm/°C |
热膨胀系数 (CTE), Above Tg | 174.0 ppm/°C |
玻璃化温度 (Tg) | -31.0 °C |
粘度 | 8500.0 mPa.s (cP) |
组分数量 | 单组份 |
触变指数 | 5.7 |
颜色 | 白 |