LOCTITE® ECCOBOND FP4530SF
功能与优点
LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. LOCTITE ECCOBOND FP4530SF is the silane-free version of LOCTITE ECCOBOND FP4530.
了解更多
技术信息
| 使用寿命 | 24.0 小时 |
| 储存温度 | -40.0 °C |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 160.0 °C | 8.0 分钟 |
| 应用 | 未充满 |
| 热膨胀系数 (CTE), Above Tg | 150.0 ppm/°C |
| 热膨胀系数 (CTE), Below Tg | 45.0 ppm/°C |
| 玻璃化温度 (Tg) | 145.0 °C |
| 粘度，博勒菲，锥型和板型, @ 25.0 °C Spindle 52, speed 20 rpm | 3300.0 mPa.s (cP) |
| 颜色 | 蓝色 |
LOCTITE® ECCOBOND FP4530SF
LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill