LOCTITE® ECCOBOND FP4530SF
Omadused ja eelised
LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. LOCTITE ECCOBOND FP4530SF is the silane-free version of LOCTITE ECCOBOND FP4530.
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Tehniline teave
| Kasutusaeg | 24.0 tund |
| Klaasistumistemperatuur (Tg) | 145.0 °C |
| Kõvenemisaeg, @ 160.0 °C | 8.0 minut |
| Rakendused | Alustäide |
| Soojuspaisumise koefitsient (CTE), Above Tg | 150.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Below Tg | 45.0 ppm/°C |
| Säilitustemperatuur | -40.0 °C |
| Tahkumistüüp | Kuumkõvenemine |
| Viskoossus, Brookfieldi koonus ja plaat, @ 25.0 °C Spindle 52, speed 20 rpm | 3300.0 mPa.s (cP) |
| Värvus | Sinine |
LOCTITE® ECCOBOND FP4530SF
LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill