LOCTITE® ECCOBOND FP4530SF
Características y Ventajas
LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. LOCTITE ECCOBOND FP4530SF is the silane-free version of LOCTITE ECCOBOND FP4530.
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Información técnica
| Aplicaciones | Rellenar |
| Coeficiente de dilatación térmica (CDT), Above Tg | 150.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Below Tg | 45.0 ppm/°C |
| Color | Azul |
| Programa de curado, @ 160.0 °C | 8.0 min |
| Temperatura de almacenaje | -40.0 °C |
| Temperatura de transición vítrea (Tg) | 145.0 °C |
| Tipo de curado | Curado Térmico |
| Vida de mezcla | 24.0 h |
| Viscosidad, Brookfield Cono & Placa, @ 25.0 °C Spindle 52, speed 20 rpm | 3300.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4530SF
LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill