LOCTITE® ECCOBOND FP4530SF

Características y Ventajas

LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. LOCTITE ECCOBOND FP4530SF is the silane-free version of LOCTITE ECCOBOND FP4530.
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Información técnica

Aplicaciones Rellenar
Coeficiente de dilatación térmica (CDT), Above Tg 150.0 ppm/°C
Coeficiente de dilatación térmica (CDT), Below Tg 45.0 ppm/°C
Color Azul
Programa de curado, @ 160.0 °C 8.0 min
Temperatura de almacenaje -40.0 °C
Temperatura de transición vítrea (Tg) 145.0 °C
Tipo de curado Curado Térmico
Vida de Mezcla 24.0 h
Viscosidad, Brookfield Cono & Placa, @ 25.0 °C Spindle 52, speed 20 rpm 3300.0 mPa.s (cP)