LOCTITE® ECCOBOND FP4530SF
Features and Benefits
LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. LOCTITE ECCOBOND FP4530SF is the silane-free version of LOCTITE ECCOBOND FP4530.
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Technical Information
| Applications | Underfilling |
| Coefficient of thermal expansion (CTE), Above Tg | 150.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 45.0 ppm/°C |
| Color | Blue |
| Cure schedule, @ 160.0 °C | 8.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 145.0 °C |
| Pot life | 24.0 hr. |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 20 rpm | 3300.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4530SF
LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill