LOCTITE® ECCOBOND UF 3810
Elementi i pogodnosti
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Tehnički podaci
| Koeficijent toplotnog širenja (CTE), Above Tg | 171.0 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Below Tg | 55.0 ppm/°C |
| Raspored polimerizacije, @ 130.0 °C | 8.0 minuta |
| Temperatura razmekšavanja (Tg) | 102.0 °C |
| Viskoznost, kugla / ploča, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa.s (cP) |
| Vreme delovanja | 3.0 dan |
LOCTITE® ECCOBOND UF 3810
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill