LOCTITE® ECCOBOND UF 3810
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LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Techniniai duomenys
| Darbo laikas | 3.0 diena |
| Kietėjimo planas, @ 130.0 °C | 8.0 min. |
| Klampumas, kūgis ir plokštė, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa.s (cP) |
| Stiklėjimo temperatūra (Tg) | 102.0 °C |
| Šiluminio plėtimosi koeficientas (CTE), Above Tg | 171.0 ppm/°C |
| Šiluminio plėtimosi koeficientas (CTE), Below Tg | 55.0 ppm/°C |
LOCTITE® ECCOBOND UF 3810
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill