LOCTITE® ECCOBOND UF 3810
功能與優點
This reworkable epoxy underfill provides excellent mechanical properties to protect solder joints during thermal cycling.
LOCTITE® ECCOBOND UF 3810 is a 1-part reworkable epoxy underfill designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components and, when cured, provides excellent mechanical properties to protect solder joints during thermal cycling. You can expect stable electrical performance even in humid conditions.
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技術資訊
| 使用期限 | 3.0 日 |
| 建議固化方式, @ 130.0 °C | 8.0 分 |
| 熱膨脹係數 (CTE), Above Tg | 171.0 ppm/°C |
| 熱膨脹係數 (CTE), Below Tg | 55.0 ppm/°C |
| 玻璃化溫度(Tg) | 102.0 °C |
| 粘度，錐型和板型, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3810
This reworkable epoxy underfill provides excellent mechanical properties to protect solder joints during thermal cycling.