LOCTITE® ECCOBOND UF 3810

Caractéristiques et avantages

LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Informations techniques

Coefficient de dilatation thermique (CDT), Above Tg 171.0 ppm/°C
Coefficient de dilatation thermique (CDT), Below Tg 55.0 ppm/°C
Programme de durcissement, @ 130.0 °C 8.0 min
Temps de service 3.0 jour
Température de transition vitreuse 102.0 °C
Viscosité, Cône & Plan, @ 25.0 °C Shear Rate 20 s⁻¹ 394.0 mPa.s (cP)