LOCTITE® ECCOBOND UF 3810
Features and Benefits
This reworkable epoxy underfill provides excellent mechanical properties to protect solder joints during thermal cycling.
LOCTITE® ECCOBOND UF 3810 is a 1-part reworkable epoxy underfill designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components and, when cured, provides excellent mechanical properties to protect solder joints during thermal cycling. You can expect stable electrical performance even in humid conditions.
- Fast cure at moderate temperatures
- Halogen free
- High Tg
- Compatible with most Pb-free solders
- Room temperature flow capability
Documents and Downloads
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 171.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 55.0 ppm/°C |
| Cure schedule, @ 130.0 °C | 8.0 min. |
| Glass transition temperature (Tg) | 102.0 °C |
| Viscosity, cone & plate, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa·s (cP) |
| Work life | 3.0 day |
LOCTITE® ECCOBOND UF 3810
This reworkable epoxy underfill provides excellent mechanical properties to protect solder joints during thermal cycling.