BERGQUIST® GAP PAD® TGP 3000
Conosciuto come Gap Pad® 3000S30
Caratteristiche e vantaggi
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
Leggi tutto
Documenti e download
Cerchi una TDS o un SDS in un'altra lingua?
Documenti aggiuntivi
Informazioni tecniche
| Capacità termiche, ASTM E1269 | 1.0 J/g-K |
| Classe di infiammabilità | V-0 |
| Colore | Azzurro |
| Costante dielettrica, ASTM D150 @ 1kHz | 7.0 |
| Densità | 3.2 g/cm³ |
| Durezza shore, Thirty second delay value, ASTM D2240 Gomma bulk Shore 00 | 30.0 |
| Resistività di volume | 1×10 Ohm m |
| Spessore standard | 0.254 - 3.175 mm |
| Temperatura di esercizio | -60.0 - 200.0 °C |
| Tensione rottura dielettrica | 3000.0 Vac |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.