BERGQUIST® GAP PAD® TGP 3000

Bekend als Gap Pad® 3000S30

Kenmerken en voordelen

Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Technische informatie

Dichtheid 3.2 g/cm³
Diëlektrische constante, ASTM D150 @ 1kHz 7.0
Diëlektrische doorslagspanning 3000.0 Vac
Gebruikstemperatuur -60.0 - 200.0 °C
Kleur Lichtblauw
Shore hardheid, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 30.0
Standaard dikte 0.254 - 3.175 mm
Vlammenclassificatie V-0
Volumeweerstandsvermogen 1×10 Ohm m
Warmtecapaciteit, ASTM E1269 1.0 J/g-K