BERGQUIST® GAP PAD® TGP 3000
Žinoma kaip Gap Pad® 3000S30
Savybės ir privalumai
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Techniniai duomenys
Darbinė temperatūra | -60.0 - 200.0 °C |
Dielektrinio gedimo įtampa | 3000.0 Vac |
Dielektrinė konstanta, ASTM D150 @ 1kHz | 7.0 |
Liepsnos įvertinimas | V-0 |
Spalva | Šviesiai mėlyna |
Standartinis storis | 0.254 - 3.175 mm |
Tankis | 3.2 g/cm³ |
Tūrio varža | 1×10 Ohm m |
Šilumos talpa, ASTM E1269 | 1.0 J/g-K |
„Shore“ kietumas, Thirty second delay value, ASTM D2240 Birioji guma Shore 00 | 30.0 |