BERGQUIST® GAP PAD® TGP 3000
Zināms kā Gap Pad® 3000S30
Iezīmes un ieguvumi
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Tehniskā informācija
| Blīvums | 3.2 g/cm³ |
| Cietība, Thirty second delay value, ASTM D2240 Lielgabarīta gumija Shore 00 | 30.0 |
| Darbības temperatūra | -60.0 - 200.0 °C |
| Dielektriskā konstante, ASTM D150 @ 1kHz | 7.0 |
| Dielektriskā sadalījuma spriegums | 3000.0 Vac |
| Krāsa | Tumši brūns |
| Liesmas novērtējums | V-0 |
| Siltuma jauda, ASTM E1269 | 1.0 J/g-K |
| Standarta biezums | 0.254 - 3.175 mm |
| Tilpuma pretestība | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.