BERGQUIST® GAP PAD® TGP 3000
U svojstvu Gap Pad® 3000S30
Značajke i prednosti
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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| Boja | Svjetloplava |
| Dielektrična konstanta, ASTM D150 @ 1kHz | 7.0 |
| Dielektrični probojni napon | 3000.0 Vac |
| Gustoća | 3.2 g/cm³ |
| Jakost plamena | V-0 |
| Otpornost volumena | 1×10 Ohm m |
| Radna temperatura | -60.0 - 200.0 °C |
| Toplinski kapacitet, ASTM E1269 | 1.0 J/g-K |
| Tvrdoća prema Shoreu, Thirty second delay value, ASTM D2240 Sipki gumeni materijal Shore 00 | 30.0 |
| Uobičajena debljina | 0.254 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.