BERGQUIST® GAP PAD® TGP 3000
Znany jako Gap Pad® 3000S30
Właściwości i korzyści
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informacje techniczne
| Grubość standardowa | 0.254 - 3.175 mm |
| Gęstość | 3.2 g/cm³ |
| Klasa palności | V-0 |
| Kolor | Jasnoniebieski |
| Napięcie przebicia dielektrycznego | 3000.0 Vac |
| Pojemność cieplna, ASTM E1269 | 1.0 J/g-K |
| Rezystywność skośna | 1×10 Ohm m |
| Stała dielektryczna, ASTM D150 @ 1kHz | 7.0 |
| Temperatura robocza | -60.0 - 200.0 °C |
| Twardość według Shore'a, Thirty second delay value, ASTM D2240 Guma luzem Shore 00 | 30.0 |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.