BERGQUIST® GAP PAD® TGP 3000

Bekannt als Gap Pad® 3000S30

Merkmale und Vorteile

Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Technische Informationen

Betriebstemperatur -60.0 - 200.0 °C
Dichte 3.2 g/cm³
Dielektrische Durchbruchspannung 3000.0 Vac
Dielektrizitätskonstante, ASTM D150 @ 1kHz 7.0
Entflammbarkeit V-0
Farbe Hellblau
Shore-Härte, Thirty second delay value, ASTM D2240 Bulk-Gummi Shore 00 30.0
Standarddicke 0.254 - 3.175 mm
Volumenwiderstand 1×10 Ohm m
Wärmekapazität, ASTM E1269 1.0 J/g-K

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