BERGQUIST® GAP PAD® TGP 3000
Bekannt als Gap Pad® 3000S30
Merkmale und Vorteile
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Technische Informationen
Betriebstemperatur | -60.0 - 200.0 °C |
Dichte | 3.2 g/cm³ |
Dielektrische Durchbruchspannung | 3000.0 Vac |
Dielektrizitätskonstante, ASTM D150 @ 1kHz | 7.0 |
Entflammbarkeit | V-0 |
Farbe | Hellblau |
Shore-Härte, Thirty second delay value, ASTM D2240 Bulk-Gummi Shore 00 | 30.0 |
Standarddicke | 0.254 - 3.175 mm |
Volumenwiderstand | 1×10 Ohm m |
Wärmekapazität, ASTM E1269 | 1.0 J/g-K |