BERGQUIST® GAP PAD® TGP 3000
Cunoscut ca Gap Pad® 3000S30
Funcții și beneficii
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informații tehnice
| Capacitatea termică, ASTM E1269 | 1.0 J/g-K |
| Constantă dielectrică, ASTM D150 @ 1kHz | 7.0 |
| Culoare | Albastru deschis |
| Densitate | 3.2 g/cm³ |
| Duritate Shore, Thirty second delay value, ASTM D2240 Cauciuc vrac Shore 00 | 30.0 |
| Evaluare flacără | V-0 |
| Grosimea standard | 0.254 - 3.175 mm |
| Rezistivitatea de volum | 1×10 Ohm m |
| Temperatura de funcționare | -60.0 - 200.0 °C |
| Tensiunea de străpungere dielectrică | 3000.0 Vac |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.