BERGQUIST® GAP PAD® TGP 3000
Γνωστό ως Gap Pad® 3000S30
Χαρακτηριστικά και οφέλη
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Τεχνικές πληροφορίες
| Αξιολόγηση μετάδοσης φλόγας | V-0 |
| Διηλεκτρική Σταθερά, ASTM D150 @ 1kHz | 7.0 |
| Ειδική αντίσταση διόγκωσης | 1×10 Ohm m |
| Θερμική ισχύς, ASTM E1269 | 1.0 J/g-K |
| Θερμοκρασία λειτουργίας | -60.0 - 200.0 °C |
| Πυκνότητα | 3.2 g/cm³ |
| Σκληρότητα Shore, Thirty second delay value, ASTM D2240 Χύδην καουτσούκ Shore 00 | 30.0 |
| Τάση διάτρησης | 3000.0 Vac |
| Τυπικό πάχος | 0.254 - 3.175 mm |
| Χρώμα | Γαλάζιο |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.