BERGQUIST® GAP PAD® TGP 3000
Известен като Gap Pad® 3000S30
Характеристики и ползи
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Техническа информация
| Диелектрична константа, ASTM D150 @ 1kHz | 7.0 |
| Класификация на запалимостта | V-0 |
| Обемно съпротивление | 1×10 Ohm m |
| Плътност | 3.2 g/cm³ |
| Пробивно напрежение на диелектрика | 3000.0 Vac |
| Работна температура | -60.0 - 200.0 °C |
| Стандартна дебелина | 0.254 - 3.175 mm |
| Твърдост по Шор, Thirty second delay value, ASTM D2240 Гума в насипно състояние Shore 00 | 30.0 |
| Топлоемкост, ASTM E1269 | 1.0 J/g-K |
| Цвят | Светлосин |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.