BERGQUIST® GAP PAD® TGP 3000
Features and Benefits
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. It is highly conformable and exhibits thermal resistance and softness. It is fiberglass-reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
- Thermal conductivity: 3.0 W/m-K
- Low thermal resistance at very low pressures
- Highly conformable softness
- Designed for low-stress applications
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Additional Documents
Technical Information
| Color | Light blue |
| Density | 3.2 g/cm³ |
| Dielectric breakdown voltage | 3000.0 Vac |
| Dielectric constant, ASTM D150 @ 1kHz | 7.0 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 1.0 J/g-K |
| Operating temperature | -60.0 - 200.0 °C |
| Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 | 30.0 |
| Standard thickness | 0.254 - 3.175 mm |
| Volume resistivity | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 3000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.