BERGQUIST® GAP PAD® TGP 3000
Conhecido como Gap Pad® 3000S30
Características e Benefícios
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informação Técnica
| Capacidade de calor, ASTM E1269 | 1.0 J/g-K |
| Classificação da chama | V-0 |
| Constante dielétrica, ASTM D150 @ 1kHz | 7.0 |
| Cor | Azul-claro |
| Densidade | 3.2 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 | 30.0 |
| Espessura padrão | 0.254 - 3.175 mm |
| Resistividade volumétrica | 1×10 Ohm m |
| Temperatura de operação | -60.0 - 200.0 °C |
| Tensão de ruptura dielétrica | 3000.0 Vac |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.