LOCTITE® ABLESTIK QMI536NB
Caratteristiche e vantaggi
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 80.0 ppm/°C |
| Coefficiente di espansione termica (CTE), Above Tg | 150.0 ppm/°C |
| Consigliato per l'uso con | Laminato, Poliammide |
| Contenuto ionico estraibile, Cloruro (CI-) | 19.0 ppm |
| Contenuto ionico estraibile, Fluoruro (F-) | 19.0 ppm |
| Contenuto ionico estraibile, Potassio (K+) | 19.0 ppm |
| Contenuto ionico estraibile, Sodio (Na+) | 19.0 ppm |
| Indice tixotropico | 5.0 |
| Resistenza al taglio matrice calda | 15.0 kg-f |
| Temperatura di transizione vetrosa (Tg) | -30.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità | 10000.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI536NB
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.