LOCTITE® ABLESTIK QMI536NB

Features and Benefits

Semi-flexible, hybrid based electrically non-conductive adhesive. Perfect for insulating die attach applications​.
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is the answer. This low bleed, non-electrically conductive, PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Technical Information

Applications Die Attach
Coefficient of thermal expansion (CTE) 80.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 150.0 ppm/°C
Cure type Heat Cure
Extractable ionic content, Chloride (CI-) 19.0 ppm
Extractable ionic content, Fluoride (F-) 19.0 ppm
Extractable ionic content, Potassium (K+) 19.0 ppm
Extractable ionic content, Sodium (Na+) 19.0 ppm
Glass transition temperature (Tg) -30.0 °C
Hot die shear strength 15.0 kg-f
Recommended for use with Laminate, Polyimide
Thixotropic index 5.0
Viscosity 10000.0 mPa·s (cP)