LOCTITE® ABLESTIK QMI536NB
功能與優點
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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技術資訊
| 可萃取出的離子含量, 氟化物(F-) | 19.0 ppm |
| 可萃取出的離子含量, 氯化物(CI-) | 19.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 19.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 19.0 ppm |
| 固化類型 | 熱固化 |
| 建議推廣應用 | 層壓, 聚酰亞胺 |
| 應用 | 晶片焊接 |
| 熱模剪切強度 | 15.0 kg-f |
| 熱膨脹係數 (CTE) | 80.0 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 150.0 ppm/°C |
| 玻璃化溫度(Tg) | -30.0 °C |
| 觸變指數 | 5.0 |
| 黏度 | 10000.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI536NB
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.