LOCTITE® ABLESTIK QMI536NB
Iezīmes un ieguvumi
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Tehniskā informācija
| Iegūstamais jonu saturs, Fluorīds (F-) | 19.0 ppm |
| Iegūstamais jonu saturs, Hlorīds (CI-) | 19.0 ppm |
| Iegūstamais jonu saturs, Kālijs (K +) | 19.0 ppm |
| Iegūstamais jonu saturs, Nātrijs (Na +) | 19.0 ppm |
| Ieteicams lietošanai ar | Lamināts, Poliimīds |
| Karstā spiedogabīdes izturība | 15.0 kg-f |
| Pielietojumi | Spiedoga pievienošana |
| Sacietināšanas veids | Sacietināšana karsējot |
| Stikla pārejas temperatūra (Tg) | -30.0 °C |
| Termiskās izplešanās koeficients (CTE) | 80.0 ppm/°C |
| Termiskās izplešanās koeficients (CTE), Above Tg | 150.0 ppm/°C |
| Tiksotropiskais indekss | 5.0 |
| Viskozitāte | 10000.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI536NB
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.