LOCTITE® ABLESTIK QMI536NB

Características y Ventajas

Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications​.
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
Leer más

Información técnica

Aplicaciones Unión
Coeficiente de dilatación térmica (CDT) 80.0 ppm/°C
Coeficiente de dilatación térmica (CDT), Above Tg 150.0 ppm/°C
Contenido iónico extraíble, Cloruro (CI-) 19.0 ppm
Contenido iónico extraíble, Fluoruro (F-) 19.0 ppm
Contenido iónico extraíble, Potasio (K+) 19.0 ppm
Contenido iónico extraíble, Sodio (Na+) 19.0 ppm
Resistencia al corte con calor 15.0 kg-f
Se recomienda su uso con Laminado, Poliimida
Temperatura de transición vítrea (Tg) -30.0 °C
Tipo de curado Curado Térmico
Viscosidad 10000.0 mPa.s (cP)
Índice tixotrópico 5.0