LOCTITE® ABLESTIK QMI536NB
Features and Benefits
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 80.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 150.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Fluoride (F-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| Glass transition temperature (Tg) | -30.0 °C |
| Hot die shear strength | 15.0 kg-f |
| Recommended for use with | Laminate, Polyimide |
| Thixotropic index | 5.0 |
| Viscosity | 10000.0 mPa·s (cP) |
LOCTITE® ABLESTIK QMI536NB
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.