BERGQUIST® GAP PAD® TGP 2000
Známe ako Gap Pad® 2000S40
Vlastnosti a výhody
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Ďalšie dokumenty
Technické informácie
| Dielektrická konštanta, @ 1kHz | 6.0 |
| Farba | Šedá |
| Hodnotenie horľavosti | V-0 |
| Hustota | 2.9 g/cm³ |
| Objemový odpor | 1×10 Ohm m |
| Prevádzková teplota | -60.0 - 200.0 °C |
| Prierazné napätie dielektrika | 5000.0 Vac |
| Tepelná kapacita, ASTM E1269 | 0.6 J/g-K |
| Tepelná vodivosť | 2.0 W/mK |
| Tvrdosť v jednotke Shore, Thirty second delay value, ASTM D2240 Sypká guma Shore 00 | 30.0 |
| Štandardná hrúbka | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.