BERGQUIST® GAP PAD® TGP 2000
Poznat kao Gap Pad® 2000S40
Elementi i pogodnosti
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
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Tehnički podaci
| Boja | Siva |
| Dielektrična konstanta, @ 1kHz | 6.0 |
| Dielektrični proboj napona | 5000.0 Vac |
| Gustina | 2.9 g/cm³ |
| Otpornost na plamen | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.508 - 3.175 mm |
| Toplotna provodljivost | 2.0 W/mK |
| Toplotni kapacitet, ASTM E1269 | 0.6 J/g-K |
| Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Guma u komadu Shore 00 | 30.0 |
| Zapreminska otpornost | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.