BERGQUIST® GAP PAD® TGP 2000

Bekend als Gap Pad® 2000S40

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This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
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Technische informatie

Dichtheid 2.9 g/cm³
Diëlektrische constante, @ 1kHz 6.0
Diëlektrische doorslagspanning 5000.0 Vac
Gebruikstemperatuur -60.0 - 200.0 °C
Kleur Grijs
Shore hardheid, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 30.0
Standaard dikte 0.508 - 3.175 mm
Thermische geleidbaarheid 2.0 W/mK
Vlammenclassificatie V-0
Volumeweerstandsvermogen 1×10 Ohm m
Warmtecapaciteit, ASTM E1269 0.6 J/g-K