BERGQUIST® GAP PAD® TGP 2000
U svojstvu Gap Pad® 2000S40
Značajke i prednosti
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
Dodatne informacije
Dokumenti i preuzimanja
Tražite list s tehničkim podacima ili list sa sigurnosnim podacima na drugom jeziku?
Dodatni dokumenti
Tehnički podaci
| Boja | Siva |
| Dielektrična konstanta, @ 1kHz | 6.0 |
| Dielektrični probojni napon | 5000.0 Vac |
| Gustoća | 2.9 g/cm³ |
| Jakost plamena | V-0 |
| Otpornost volumena | 1×10 Ohm m |
| Radna temperatura | -60.0 - 200.0 °C |
| Toplinska vodljivost | 2.0 W/mK |
| Toplinski kapacitet, ASTM E1269 | 0.6 J/g-K |
| Tvrdoća prema Shoreu, Thirty second delay value, ASTM D2240 Sipki gumeni materijal Shore 00 | 30.0 |
| Uobičajena debljina | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.