BERGQUIST® GAP PAD® TGP 2000

Bekannt als Gap Pad® 2000S40

Merkmale und Vorteile

This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
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Technische Informationen

Betriebstemperatur -60.0 - 200.0 °C
Dichte 2.9 g/cm³
Dielektrische Durchbruchspannung 5000.0 Vac
Dielektrizitätskonstante, @ 1kHz 6.0
Entflammbarkeit V-0
Farbe Grau
Shore-Härte, Thirty second delay value, ASTM D2240 Bulk-Gummi Shore 00 30.0
Standarddicke 0.508 - 3.175 mm
Volumenwiderstand 1×10 Ohm m
Wärmekapazität, ASTM E1269 0.6 J/g-K
Wärmeleitfähigkeit 2.0 W/mK

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