BERGQUIST® GAP PAD® TGP 2000
Conhecido como Gap Pad® 2000S40
Características e Benefícios
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
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Informação Técnica
| Capacidade de calor, ASTM E1269 | 0.6 J/g-K |
| Classificação da chama | V-0 |
| Condutividade térmica | 2.0 W/mK |
| Constante dielétrica, @ 1kHz | 6.0 |
| Cor | Cinza |
| Densidade | 2.9 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 | 30.0 |
| Espessura padrão | 0.508 - 3.175 mm |
| Resistividade volumétrica | 1×10 Ohm m |
| Temperatura de operação | -60.0 - 200.0 °C |
| Tensão de ruptura dielétrica | 5000.0 Vac |
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.