BERGQUIST® GAP PAD® TGP 2000

Known as Gap Pad® 2000S40

Features and Benefits

This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
  • Thermal Conductivity: 2.0 W/m-K 
  • Low "S-Class" thermal resistance at very low pressures
  • Designed for low-stress applications
  • Highly conformable
  • Low hardness
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Technical Information

Color Gray
Density 2.9 g/cm³
Dielectric breakdown voltage 5000.0 Vac
Dielectric constant, @ 1kHz 6.0
Flame rating V-0
Heat capacity, ASTM E1269 0.6 J/g-K
Operating temperature -60.0 - 200.0 °C
Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 30.0
Standard thickness 0.508 - 3.175 mm
Thermal conductivity 2.0 W/mK
Volume resistivity 1×10 Ohm m