BERGQUIST® GAP PAD® TGP 2000

Zināms kā Gap Pad® 2000S40

Iezīmes un ieguvumi

This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
Apraksts

Tehniskā informācija

Blīvums 2.9 g/cm³
Cietība, Thirty second delay value, ASTM D2240 Lielgabarīta gumija Shore 00 30.0
Darbības temperatūra -60.0 - 200.0 °C
Dielektriskā konstante, @ 1kHz 6.0
Dielektriskā sadalījuma spriegums 5000.0 Vac
Krāsa Pelēka
Liesmas novērtējums V-0
Siltuma jauda, ASTM E1269 0.6 J/g-K
Siltumvadītspēja 2.0 W/mK
Standarta biezums 0.508 - 3.175 mm
Tilpuma pretestība 1×10 Ohm m