BERGQUIST® GAP PAD® TGP 2000SF
Conosciuto come Gap Pad® 2000SF
Caratteristiche e vantaggi
BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.
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Informazioni tecniche
Colore | Verde |
Conducibilità termica | 2.0 W/mK |
Modulo di Young, ASTM D575 | 228.0 KPa (33.0 psi ) |
Spessore standard | 0.254 - 3.175 mm |
Temperatura di esercizio | -60.0 - 125.0 °C |
Tipo carrier | Fibra di vetro |