BERGQUIST® GAP PAD® TGP 2000SF

Known as Gap Pad® 2000SF

Features and Benefits

BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.
  • High Thermal Conductivity: 2 W/m-K
  • Natural inherent tack reduces interfacial thermal resistance and aids assembly
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Conforms to demanding contours and maintains structural integrity with little stress applied to fragile component leads
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Technical Information

Carrier type Fiberglass
Color Green
Operating temperature -60.0 - 125.0 °C
Standard thickness 0.254 - 3.175 mm
Thermal conductivity 2.0 W/mK
Young's modulus, ASTM D575 228.0 KPa (33.0 psi )