BERGQUIST® GAP PAD® TGP 2000SF

BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.