BERGQUIST® GAP PAD® TGP 2000SF

被称为 Gap Pad® 2000SF

功能与优点

BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.
  • 导热性能:2 W/m-K
  • 自带粘性,可降低界面热阻,便于装配
  • 增强型玻璃纤维,抗穿刺,抗剪切,抗撕裂
  • 对复杂表面具有高顺应性,可保持结构完整,对脆弱元件引线几乎不产生应力
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技术信息

导热性 2.0 W/mK
操作温度 -60.0 - 125.0 °C
杨氏模量, ASTM D575 228.0 KPa (33.0 psi )
标准厚度 0.254 - 3.175 mm
载体类型 玻璃纤维
颜色 绿色

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