BERGQUIST® GAP PAD® TGP 2000SF
Γνωστό ως Gap Pad® 2000SF
Χαρακτηριστικά και οφέλη
BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.
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Έγγραφα και λήψεις
Ψάχνετε για TDS ή SDS σε άλλη γλώσσα;
Τεχνικές πληροφορίες
| Θερμική αγωγιμότητα | 2.0 W/mK |
| Θερμοκρασία λειτουργίας | -60.0 - 125.0 °C |
| Μέτρο Υoung, ASTM D575 | 228.0 KPa (33.0 psi ) |
| Τυπικό πάχος | 0.254 - 3.175 mm |
| Τύπος μεταφοράς | Υαλοβάμβακας |
| Χρώμα | Πράσινο |
BERGQUIST® GAP PAD® TGP 2000SF
BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material