LOCTITE ABLESTIK 8006NS
fitur dan keuntungan
LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive
LOCTITE® ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt.
- B-Stageable
- Offers improved printability
- Non-conductive
- Engineered to accurately control bondline thickness and die tilt
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Formulir Fisik | Pasta |
| Indeks Tiksotropik | 1.3 |
| Jadwal Pengerasan, @ 160.0 °C | 2.0 hr. |
| Jenis Filler | Alumina/Silika |
| Kekuatan Geser Die RT, 2 x 2 mm Si die on ceramic | 13.0 kg-f |
| Konduktivitas Termal | 0.44 W/mK |
| Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 9.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 14.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 9.0 ppm |
| Kunci Karakteristik | Konduktivitas: Tidak Konduktif Elektrik, Bisa Dicetak, Layar Dapat Dicetak |
| Metode Aplikasi | Sistem dosis |
| Modulus Tensil, @ 150.0 °C | 1196.0 N/mm² (176400.0 psi ) |
| Nomor Komponen | 1 Part |
| Resistivitas Volume | 0.43x10¹⁴ Ohm cm |
| Teknologi | Epoxy |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 55000.0 mPa.s (cP) |
| Warna | Putih |
LOCTITE ABLESTIK 8006NS
LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive