Features and Benefits

LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive
LOCTITE® ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt.
  • B-Stageable
  • Non-conductive
  • Offers improved printability
  • Engineered to accurately control bondline thickness and die tilt
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Technical Information

Application Method Dispense Equipment
Applications Die Attach
Color White
Cure Schedule Temperature (Step 1) 320
Cure Schedule Temperature Unit (Step 1) °F
Cure Schedule Time (Step 1) 2
Cure Schedule Time Unit (Step 1) hr.
Cure Type Heat Cure
Filler Type Alumina/Silica
Key Characteristics Printable
Maximum Extractable Cl- Content 14 ppm
Maximum Extractable K+ Content 9 ppm
Maximum Extractable Na+ Content 9 ppm
Moisture Absorption Condition wt.% @ 85°C/85°RH
Number of Components 1 Part
Physical Form Paste
RT Die Shear Strength 13 kg-f
RT Die Shear Strength Condition 2 x 2 mm Si die on ceramic
Technology Epoxy
Tensile Modulus 1196 MPa
Tensile Modulus Temperature 150 °C
Thermal Conductivity 0.44 W/mK
Thixotropic Index 1.3
Viscosity 55000 mPa.s (cP) Brookfield
Volume Resistivity 0.43x1014 Ohm cm