LOCTITE® ECCOBOND UF 3800
Vlastnosti a výhody
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Koeficient tepelnej rozťažnosti (CTE), Above Tg | 188.0 ppm/°C |
| Koeficient tepelnej rozťažnosti (CTE), Below Tg | 52.0 ppm/°C |
| Plán vytvrdnutia, @ 130.0 °C | 8.0 min. |
| Teplota priepustnosti skla (Tg) | 69.0 °C |
| Viskozita, Physica MCR100 @ 25.0 °C Spindle CP50-1 | 375.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3800
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill