LOCTITE® ECCOBOND UF 3800
Elementi i pogodnosti
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
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Dokumenti i preuzimanja
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Tehnički podaci
| Koeficijent toplotnog širenja (CTE), Above Tg | 188.0 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Below Tg | 52.0 ppm/°C |
| Raspored polimerizacije, @ 130.0 °C | 8.0 minuta |
| Temperatura razmekšavanja (Tg) | 69.0 °C |
| Viskoznost, Physica MCR100 @ 25.0 °C Spindle CP50-1 | 375.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3800
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill